The process of measuring BGA samples for thermal warpage is subject to industry standards from both JEDEC, in JESD22-B112C and JEITA ED7306. Additionally, these standards establish allowable warpage values based on ball size and ball pitch, for the JEDEC standard, pass/fail further established in JEDEC SPP-024.3 Standard practice in these standards for measuring BGA warpage is to remove the solder balls in order to measure only the substrate surface. However, as both ball size and package thickness decrease, the practicality of removing solder balls without altering the sample shape has become increasingly challenging.

Power electronics board assemblies are central to modern vehicle power systems. They include voltage regulators, motor drivers, inverters, DC-DC converters, and onboard chargers, which are found across the range of today's vehicles, from conventional combustion engines to hybrids and full electric vehicles. However, modern power PCBAs do far more than just route and manage electrical energy flow through the vehicle, converting and regulating power for everything from the starter and alternator to the traction motor.

Solder joint voiding remains a critical reliability concern in electronic packaging, particularly for high-performance and safety-critical applications such as automotive electronics. Excessive voiding can adversely affect both thermal conductivity and mechanical strength, leading to elevated junction temperatures, accelerated fatigue failure under thermal cycling, and ultimately reduce product lifetime.