Over the past decade, the conversation around PCB innovation in aerospace and defense has often centered on high-density interconnects, advanced materials, and tighter design-to-fabrication collaboration. But the move toward rigid-flex is a quieter shift that has been gaining momentum, and it’s changing how primes and system integrators approach the physical architecture of mission-critical electronics.

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Every year, the Pentagon publishes a national security strategy. The newest version is in its final stages of development. It is said to indicate China remains a top priority for deterrence, but there is a renewed emphasis on the homeland and the Western Hemisphere.

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The rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design

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