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March 25, 2025
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Shane Whiteside, PCBAA |
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In today’s chaotic political environment, you might have missed the fact that Congress allocated nearly $3 billion to rip out and replace key components in America’s telecommunications networks. The funding is to remove equipment from networks nationwide because of cyberattacks on internet routers and cellular networks enabled by a Chinese company that makes more than half of the routers sold in the U.S. We know from prior experience and similar transgressions that we cannot trust that Chinese components aren’t being used for nefarious purposes.
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Nolan Johnson, I-Connect007 |
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The European Union Competitiveness Compass is a strategic roadmap adopted by the European Commission to guide priorities for the next five years. In this interview, Alison James, IPC senior director of Europe government relations, explains how IPC has been proactive in aligning with the roadmap by conducting a study and organizing an electronics industry Call for Action that highlights the need to bolster Europe’s electronics manufacturing base and reduce regulatory and administrative burdens.
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Marcy LaRont, PCB007 Magazine |
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Paige Fiet is a graduate of the IPC Emerging Engineer program and now works at TTM Technologies in Logan, Utah. She was an IPC Student Board Member and has been a columnist for I-Connect007. She is a stellar example and an encouragement to other young engineers about how to be successful in your early career.
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tec-thermal: High-Performance IMS Material Technology - Designed for the world’s most thermally demanding PCB applications - Automotive, medical, industrial, aerospace & military manufacturers rely on Ventec for the latest advances in IMS materials that deliver an exceptional thermal performance, reliability and quality through their established ceramic-filled halogen-free dielectric technology. With tec-thermal, Ventec offers the most comprehensive range of thermally conductive materials with the widest choice of dielectric thicknesses and dielectric thermal conductivity. Learn more. |
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Military and Aerospace Electronics News |
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