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all4-PCB - Your PCB Industry Solution Provider for 20 Years!
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Since 2002, all4-PCB has been a trusted supplier of PCB equipment and materials, offering innovative, reliable process solutions with the support of industry veterans. We provide equipment and services for the PCB, Advanced Packaging Substrate, LTCC, and Chemical Milling industries. Our dedicated team of engineers and extensive parts inventory in Glendale, CA ensures technical support. With expertise in Via Fill, Imaging, Fabrication, Process Automation, and more, we offer complete process solutions, not just equipment.
For more info visit all4-PCB.us or email us at info@all4-PCB.us and be sure to visit us at Booth 4700.
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Burkle’s MULTILAM Lamination System: The Ultimate Solution for the PCB Industry
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Transform PCB Manufacturing with Burkle North America's Advanced Lamination Solutions. As the demand for high-quality PCBs soars, Burkle North America leads the way with state-of-the-art lamination technology. From our innovative Workcell concept to scalable mass lamination capabilities, we deliver unmatched precision, efficiency, and reliability. Experience seamless Industry 4.0 integration, real-time process control, and expert support designed to optimize your production. Whether you're scaling operations or tackling complex designs, Burkle's solutions empower you to achieve peak performance.
Visit us in Booth 4120, on our website, or LinkedIn to discover how our cutting-edge PCB lamination lines can transform your manufacturing process.
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IEC—Dedicated to Providing All Your PCB Production Solutions
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Come visit with your IEC account manager, more of our fantastic team members, and many other IEC supply partners on the show floor. You can find us at the following booths:
Atg- 3934, DIS- 4134, Eternal- 3938, Pluritec- 3938, Rogers Corporation- 4231, RBP- 3938, Sigma-Mecer- 3938, and SUSS- 3938
For information on arranging a meeting with IEC and your account manager at the show, please contact blaine.mclellan@ieccan.com.
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Orbotech NeosTM Field Proven Inkjet Solution for Solder Mask
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KLA’s inkjet solution for PCB solder mask (SM) features a 100% additive printing method. The resource-efficient Orbotech NeosTM eliminates process steps, consuming less power materials and chemicals. Powered by KLA’s innovative Structural PrintingTM and DotStream ProTM technologies, KLA’s field-proven solution simplifies SM printing and drastically reduces time to market. Ensuring consistent quality and reliability of the SM layer, Orbotech Neos reduces total cost of ownership.
Visit KLA in Booth 4713 and online at kla.com.
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MivaTek Global: Leader in Direct Imaging and Registration Technologies
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MivaTek Global, a leader in direct imaging technology, has just evolved to become a dynamic registration and process control tool. MivaTek will release the latest offering in its DART, DART Scan, which will be available to new and existing customers. DART Scan provides the ability to seamlessly add up to 144 reference points to a substrate and measure them in 3 seconds or less. The ability to add orders of magnitude more granularity of registration while increasing throughput is a gamer changer.
DART Technology…It Changes Everything. See it in Booth 4305 and online at mivatek.global.
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SCHMOLL AMERICA Supporting PCB Manufacturing with Localized Expertise
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Schmoll America, the North American division of Schmoll Maschinen, delivers top-tier service for the region’s PCB manufacturing needs. Since its launch in April 2024, the team has grown by over 50%, with 20 skilled engineers across North America. Schmoll America ensures precision, reliability, and rapid response, offering exceptional support throughout the customer journey. Dedicated to innovation and excellence, Schmoll America is committed to providing fast, reliable support and customized solutions for PCB manufacturers.
Visit us at Booth 4123 to learn more and follow us on LinkedIn and X.
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Full Scale Automation and Smart Factory Solutions from Technica
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Technica is positioned to discuss simple or full-scale automation solutions with the cooperation of its supply partners. Make your production hours count, integrating reliable hardware and software automation solutions where it starts.
Consider automation for certain purposes, such as lowering operating costs, improving work safety, reducing factory lead times, increasing production output, improving quality, or achieving a smart factory environment. Understanding your short- and long-term goals will determine the hardware and software tools that will be required to meet your goals and achieve a desired outcome. Visit us at Booth 4110 or online for more information.
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We’re Already There!
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HDI and UHDI are industry’s future, and in semiconductors, IC substrates and advanced microelectronics, MEC has processes that are needed now by the mainstream PWB industry. MEC processes, available throughout North America exclusively from Uyemura, include ultra-low etchants, differential etchants for mSAP, flash etchants for SAP, anisotropic etchants, micro via fill, and electroless copper. Also featured: Uyemura’s RAIG (Reduction-Assisted Immersion Gold) deposits 6-8µm gold with zero nickel corrosion. Uyemura electroless pure palladium was engineered for ENEPIG and wire bond applications; Direct Immersion Gold produces dense, non-porous deposits up to 0.3µm, meets highest standards for HF and fine pattern compatibility.
Visit Uyemura Booth 3903 and online at uyemura.com.
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