Tim Burke, CTO and co-founder of Arch Systems, is presenting a new course through IPC, AI Applications of Machine Data in the EMS Industry. These topics—AI, machine learning, and Connected Factory Exchange (CFX)—are top of mind in the industry, and in this interview, Tim shares insights into how his company helps customers leverage machine data analytics to enhance manufacturing efficiencies and the tremendously important role of AI, which is making more meaningful data aggregation and its usage significantly easier for everyone.

As soon as we cross below the 1-mil (0.001") line width threshold, we need to stop talking in terms of mils and ounces and begin talking in terms of microns. For reference, a 3-mil trace is 75 microns, so a 1-mil trace is 25 microns. In general terms, ultra high density interconnect refers to line and spaces on a printed circuit board that are sub-25 micron. In the context of this article, ultra high-definition interconnect (UHDI) refers to the technology and infrastructure used to transmit and connect ultra high-definition signals, typically 4K, 8K, or even higher resolutions, across devices like displays, cameras, servers, and processors.

The push toward automation in electronics manufacturing has led to significant improvements in SMT and through-hole technology (THT) production. Today’s manufacturers are outfitted with precision pick-and-place machines, sophisticated inspection systems, and advanced solder deposition solutions. These investments reflect a broader industry trend toward automating high-value production tasks to boost efficiency, improve quality, and reduce headcount in a shrinking labor market. While the spotlight has rightly focused on automating SMT production, one crucial area remains woefully under-invested: materials storage and handling.