September 18, 2026 

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Nolan Johnson, I-Connect007

The middle months of 2026 have been defined by, shall we say, “projects” throughout the industry, and as we approach the end of the third quarter, many of those projects are coming to light. That’s the theme I’m getting from this week’s news, and I tried to capture it with my selections. My must-reads include a market update on the leading fabless semiconductor houses, a call to action from SEMI directed at the policymakers in the European Union, a rollup of workforce and educational programs announced just this week, a role change at Indium, and the relaunch of the Global Electronics Association Sustainability teams’ DMA Toolkit.  


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Mexico Solders On With Indium Corporation

Nolan Johnson, SMT007 Magazine

It makes sense to go where the customers are, which is why Indium Corporation recently opened a new solder paste manufacturing facility in Guadalajara, Mexico. Chris Bastecki, vice president of the Americas Sales and Service Group at Indium Corporation, as well as vice president of PCB Assembly Materials, discusses the reasons behind the new facility, the growing market segments, and the challenges of matching solder to specific applications.


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White Paper of the Week

Strategies for Efficient Material Management in Circuit Board Assembly: Balancing Cost, Labor, and Quality Control—Part 1 - This paper explores strategies for efficient material management in PCB assembly, emphasizing cost control, labor reduction, and quality assurance, while highlighting the importance of material registration, real-time tracking, and optimized storage solutions. Download now.
 


PCB Design Takes Center Stage at FED’s Design Awards

Marcy LaRont, I-Connect007

PCB designers often work behind the scenes, but their decisions can determine whether an electronic product succeeds in manufacturing. At the FED Annual Conference in Germany on Sept. 23, the PCB Design Award 2026 will put that work in the spotlight. Marcy LaRont interviewed FED Managing Director Christoph Bornhorn and board member Erika Reel about what makes a winning design, and how the profession is changing as AI, automation, and other technologies reshape electronics development.


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Book of the Month

Will Your Vias Survive the Heat?
The Printed Circuit Assembler's Guide to... Via Structures: Reflow Process Survivability, Reliability, and Robustness, the latest book from I-Connect007’s respected technical library, challenges long-held assumptions about how the electronics industry evaluates PCB via structures. Drawing on decades of experience, author Bob Neves combines technical depth with practical guidance, providing engineers and manufacturers with a roadmap for evaluating today's increasingly complex via structures with greater accuracy and confidence. Download your free copy today.
 
 
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