This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!

The U.S. Chips Act Propels Collaboration Between Semiconductor Manufacturers and Equipment Suppliers In today's rapidly evolving world, the semiconductor industry stands as a driving force across economies and industries, propelling progress through technological advancements. The U.S. Chips Act emerges as a game-changing legislation aimed at redefining America's semiconductor manufacturing prowess. The Act sets forth a clear mission: bolster domestic chip production, reinforce national security, and stimulate economic growth.

Tribal knowledge is important and quite common in the electronics manufacturing industry—for good reason. Many engineers, technicians, and operators have formed their careers around building PCBs. Some even worked alongside the founding fathers of electronics. Newer, young minds stand on the shoulders of this knowledge base. As a process engineer, I work with operators who have been coating panels with solder mask longer than I’ve been alive. Some know the exact coating parameters required for the toughest of designs. To watch them hand-screen panels is like learning the nuances of a family recipe handed down through generations.